ENDICOTT, NY – EI Technologies Europe, Ltd, a subsidiary of Endicott Interconnect Technologies, Inc., (EI) will use the IMAPS 17th European Microelectronics and Packaging Conference and Exhibition to showcase its advanced electronic semiconductor packaging and assembly solutions.  In addition, Mr. Steve Payne, Director of European Operations for EI Technologies Europe, will present a poster session entitled “Miniaturization of Printed Circuit Board Assemblies into System-in-Package (SiP)”. 

EI will showcase its organic semiconductor packaging, providing outstanding field reliability and designed to meet the needs of high performance applications.  Semiconductor packaging offerings include HyperBGA®, CoreEZ® and Wire Bond PBGA. 

The 17th European Microelectronics and Packaging Conference and Exhibition (EMPC 2009) takes place at Palacongressi in Rimini, Italy, June 15th – 18th, 2009 and features a powerful technical program and progressive professional development courses to complement the exhibition.